Hyper Very Low Profile (HVLP) Copper Foil
HVLP copper foil features an ultra-smooth surface (M-surface Rz ≤1.5μm) for exceptional etching accuracy and signal integrity. With superior thermal stability, ductility, and balanced peel strength, it is ideal for automotive mmWave radar, AI server GPU substrates, and high-speed large-size PCBs.
Material Properties Table
Items | Units | Parameters | |||
Product Series | / | HVLP1 | HVLP2 | HVLP3 | |
Thickness | μm | 12–35 | |||
Area Density | g/m2 | 102±4--283±6 | |||
Roughness | S side, Ra | μm | ≤0.38 | ≤0.38 | ≤0.38 |
M side, Rz | μm | ≤ 2.0 | ≤1.5 | ≤1.0 | |
Tensile Strength | R.T.(23℃) | Mpa | ≥330 | ||
H.T.(180℃) | ≥170 | ||||
Elongation | R.T.(23℃) | % | ≥3.0 | ||
H.T.(180℃) | ≥4.0 | ||||
Peel Strength (EM890) | N/mm | ≥0.45 | ≥0.45 | ≥0.35 | |
Pinholes and Permeation Points | / | None | |||
SEM Morphology
Application Scenarios
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No687 Gaoxinliu Road, High-tech Industrial Development District, Fuzhou, Jiangxi Province, China
Tel: 0794-2150182
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Website:www.jxtongbo.com
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