Reseve Treated (RTF) Copper Foil
RTF copper foil is engineered for high-frequency circuits. Featuring uniform surface profile via reverse treatment, it ensures high double-sided peel strength, thermal stability, and ductility, balancing signal integrity with interlayer adhesion—ideal for server motherboards, mmWave radar, and AI servers.
Material Properties Table
Items | Units | Parameters | |||
Product Series | / | RTF1 | RTF2 | RTF3 | |
Thickness | μm | 12–35 | |||
Area Density | g/m2 | 107±5--283±6 | |||
Roughness | Un-treated side, Rz | μm | ≤4.0 | ≤4.0 | ≤3.8 |
Treated side, Rz | μm | ≤ 3.0 | ≤2.5 | ≤2.0 | |
Tensile Strength | R.T.(23℃) | Mpa | ≥300 | ||
H.T.(180℃) | ≥180 | ||||
Elongation | R.T.(23℃) | % | ≥3.0 | ||
H.T.(180℃) | ≥3.0 | ||||
Peel Strength (EM285)) | N/mm | ≥0.6 | ≥0.45 | ≥0.45 | |
Pinholes and Permeation Points | / | None | |||
SEM Morphology
Application Scenarios
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No687 Gaoxinliu Road, High-tech Industrial Development District, Fuzhou, Jiangxi Province, China
Tel: 0794-2150182
Email:tbhr@jxtbkj.top
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Website:www.jxtongbo.com
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