High Temperature Elongation (HTE) Copper Foil
Designed for demanding electronics, HTE copper foil maintains stable mechanics at 180°C (elongation ≥3.0%) and resists oxidation (200°C/60min). Roughened surface ensures adhesion, serving automotive, aerospace, and multilayer PCBs.
Material Properties Table
Items | Units | Parameters | |||||||
Thickness | μm | 10 | 12 | 15 | 18 | 35 | 50 | 70 | |
Area Density | g/m2 | 91±3 | 108±4 | 125±5 | 153±5 | 283±6 | 450±9 | 575 ± 10 | |
Roughness | S side, Ra | μm | ≤0.40 | ||||||
M side, Rz | μm | 3.5–6.0 | 3.5–6.0 | 3.5–7.0 | 4.5–8.0 | 5.0–11.0 | 5.5–13.0 | 6.0–14.0 | |
Tensile Strength | R.T.(23℃) | Mpa | ≥300 | ||||||
H.T.(180℃) | ≥180 | ||||||||
Elongation | R.T.(23℃) | % | ≥3 | ≥3 | ≥3.5 | ≥4.0 | ≥8 | ≥12 | ≥14 |
H.T.(180℃) | ≥3 | ≥3 | ≥3 | ≥3 | ≥3.5 | ≥4.5 | ≥4.5 | ||
Peel Strength (General TG) | N/mm | ≥0.8 | ≥1.15 | ≥1.25 | ≥1.35 | ≥1.80 | ≥1.90 | ≥2.15 | |
Pinholes and Permeation Points | / | None | |||||||
SEM Morphology
Application Scenarios
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No687 Gaoxinliu Road, High-tech Industrial Development District, Fuzhou, Jiangxi Province, China
Tel: 0794-2150182
Email:tbhr@jxtbkj.top
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Website:www.jxtongbo.com
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