Low Profile (LP）Copper Foil
Developed for high-speed/flexible electronics, this LP copper foil (Rz 3.0–4.5μm) ensures signal integrity. With ≥7.0% elongation and 180°C stability, it delivers flexibility and adhesion for HDI, auto radar, wearables, and FPCs.
Material Properties Table
Items | Unit | Parameters | ||||
Thickness | μm | 12 | 18 | 30 | 35 | |
Area Density | g/m2 | 108±4 | 153±5 | 237±5 | 275±6 | |
Roughness | S side, Ra | μm | ≤0.40 | |||
M side, Rz | μm | ≤5.2 | ≤5.7 | ≤6.2 | ≤6.5 | |
Tensile Strength | R.T.(23℃) | Mpa | ≥380 | |||
H.T.(180℃) | ≥150 | |||||
Elongation | R.T.(23℃) | % | ≥5 | ≥7 | ≥10 | ≥12 |
H.T.(180℃) | ≥5 | ≥11 | ||||
Peel Strength (General TG) | N/mm | 0.85 | 1.05 | 1.2 | 1.35 | |
Pinholes and Permeation Points | / | None | ||||
SEM Morphology
Application Scenarios
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No687 Gaoxinliu Road, High-tech Industrial Development District, Fuzhou, Jiangxi Province, China
Tel: 0794-2150182
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Website:www.jxtongbo.com
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