Traditional Electronic Components Solutions
Our copper foil combines high conductivity with excellent signal integrity. It provides a stable and reliable conductive foundation for traditional electronic components and accurately safeguards circuit performance.
10–105 μm:
Custom thickness enables versatile substrates for high-density and high-power applications, meeting heat dissipation and reliability needs in compact spaces.
99.8%:
Featuring 99.8% purity, this copper foil minimizes signal loss and thermal risks, providing a reliable conductive base for automotive electronics and high-end PCBs to ensure durable circuit performance.
High Peel Strength:
Ensuring secure copper-substrate bonding, withstanding harsh conditions to provide reliable, delamination-free connections for demanding applications like automotive electronics and mobile PCBs.
AI Hardware and AI Applications Solutions
With its hyper ultra-low profile ensuring minimal signal loss, exceptional strength for precision manufacturing, and superior heat dissipation to support high-speed AI chip operation, it provides stable and reliable fundamental material support for AI hardwares.
≤1.5 μm:
With a hyper ultra-low profile below 1.5μm, it provides an exceptionally smooth surface for AI server PCBs , significantly reducing high-frequency signal transmission loss and latency. This ensures seamless, lossless data transfer between chips, supporting continuous advancement in computing power.
200℃:
With high thermal stability, it withstands extreme thermal loads from AI chips and servers, maintaining structural integrity and conductivity under prolonged high temperatures 200℃. This provides a reliable thermal and electrical foundation for sustained high-intensity computing power.
Stable Physical Properties:
Its exceptional stability preserves dimensional and electrical properties under AI servers' high-density, high-heat conditions, ensuring signal integrity, reliability, and 24/7 operational support for computing infrastructure.
5G/6G Communication Solutions
Our copper foil with ultra-low profile, drastically reducing signal insertion loss in millimeter-wave bands. With high peel strength and excellent elongation, it ensures reliable formation of precision circuits, delivering a high-speed, stable connectivity core for 5G/6G devices.
≤1.0 μm:
Ultra-smooth copper foil minimizes signal loss and distortion in millimeter-wave bands, ensuring signal purity and system stability for 5G/6G base stations, radar, and antennas.
Stable Peeling Strength:
Secure copper-substrate bonding under extreme temperatures and vibration ensures stable 5G/6G signal transmission with zero interruption for outdoor base stations and radar antennas.
Thickness Uniformity:
Uniform copper foil thickness ensures consistent high-frequency PCB impedance, enabling precise millimeter-wave transmission with low reflection and distortion for 5G/6G base stations and antennas.
IC Substrate Solutions
Leveraging the micron-level thickness and nanoscale profile enabled by a two-layer copper foil consisting of a peelable firm 18µm carrier foil and an ultra-thin copper foil, signal insertion loss is reduced to near zero, ensuring lossless transmission of chip computing power.
≤3 μm:
Designed with ≤3μm thickness for MSAP processes, this foil provides a precision starting layer for micron-scale circuits, boosting wiring density and signal integrity in IC substrates to support advanced chip packaging.
≤2 μm:
With ≤2μm roughness, this smooth surface minimizes skin effect and signal loss, ensuring signal integrity for IC substrates and advanced chip packaging with lossless high frequency/ high-speed data transfer.
Peelability:
Ensuring clean, complete carrier removal after ultra-thin copper foil processing, it enables damage-free fine-line circuitry—key to IC substrate yield improvement and advanced packaging.
Welcome to the official website of Jiangxi Tongbo Technology Co., Ltd.
If you are interested in our products and services, please feel free to contact us or leave us a message. We will wholeheartedly serve you.
Company Address:
No687 Gaoxinliu Road, High-tech Industrial Development District, Fuzhou, Jiangxi Province, China
Tel: 0794-2150182
Email:tbhr@jxtbkj.top
Fax: 0794-2150182
Website:www.jxtongbo.com
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