Core Technology
01
Lithium Battery Copper Foil
•High Strength High Elongation Ultra-thin Copper Foil Production TechnologyThrough optimized additive formulations and electrolytic process parameters, we achieve uniform, fine, and preferentially oriented grains. This enables the copper foil to maintain high tensile strength and high elongation even after thinning.
• Ultra-High Strength / Ultra-Strong Ultra-Thin Copper Foil Production Technology
While maintaining an ultra-thin thickness of 4–6 µm, the tensile strength consistently exceeds 700 MPa, meeting the stringent requirements of high-energy-density silicon-anode lithium batteries.
•Production Technology for Porous Copper Foil for Solid-Liquid Hybrid Batteries
The core technology of porous copper foil lies in the fabrication of controllable pore structures through either laser or electrochemical methods.
•Production Technology for Multi-Metal Anode Current Collector Materials for All-Solid-State Batteries
Through material-level alloying and coating protection, combined with process-level precision deposition and surface treatment, the resulting alloy copper foil is suitable for all-solid-state batteries requiring high energy density and a wide operating temperature range.
02
Electronic Circuit Copper Foil
•Reverse Treated Foil (RTF) Production Technology
Focusing on "double-sided differential treatment + precision process control," we achieve extremely low roughness on the shiny side while maintaining moderate roughness on the matte side. This enables the production of high-performance copper foil with low signal loss, high thermal and electrical conductivity, and uniform stress distribution and consistent thickness, ideal for high-frequency, high-speed applications.
•Hyper Very Low Profile (HVLP) Copper Foil Production Technology
Focusing on the objectives of "ultra-low surface profile, high conductivity with low loss, high thermal strength, and high adhesion," the key technological approaches are:
Achieving an ultra-low roughness of Rz ≤ 0.8 µm on the treated surface through precise additive formulation and process control.
Minimizing the skin effect impact through this ultra-low profile, thereby reducing signal insertion loss.
Ensuring thermal stability via a high-temperature oxidation layer and annealing processes.
03
Manufacturing Equipments
•Energy-Efficient and High-Performance Copper Dissolution Process Enhancement Technology
Through the modification of copper dissolution equipment, the gas-liquid mixing efficiency is enhanced, ensuring thorough contact and reaction among acid, gas, and copper. This leads to improved copper dissolution efficiency, thereby addressing the issue of low copper concentration caused by inefficient dissolution during high-current production processes.
• High-Current Long-Length Foil Production Process Enhancement Technology
This technology incorporates edge tear prevention techniques and optimizes the edge trimming process to reduce the frequency of tearing during raw foil production. By improving the winding unit, it minimizes winding anomalies, thereby enabling the production of long-length copper foil. Ultimately, it addresses issues such as cathode oxidation, edge tearing, and poor product consistency under high-current conditions, which often lead to large-roll winding abnormalities.
•Ultra-Low Chromium Based Anti-Oxidation Technology
This technology enables precise control of the chromium ion concentration in the passivation solution. By integrating this with regulation of the micro-current field and production speed, it maintains a dynamic balance of chromium ion concentration on the copper foil surface throughout the passivation process. This ensures the formation of a uniform, dense, and thin chromium plating layer after passivation, which effectively isolates the copper foil surface from air, thereby preventing oxidation.
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Company Address:
No687 Gaoxinliu Road, High-tech Industrial Development District, Fuzhou, Jiangxi Province, China
Tel: 0794-2150182
Email:tbhr@jxtbkj.top
Fax: 0794-2150182
Website:www.jxtongbo.com
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