Mr.Xu Chao
Release time:
2026-02-06
Over the past seventeen years of deep involvement in the copper foil sector, Mr.Xu Chao has progressed from frontline craftsmanship to research and development breakthroughs. Guided by an unwavering dedication to craftsmanship and a pragmatic approach to overcoming barriers, Mr.Xu has honed our skills and driven innovation within the confines of copper foil, led team in tackling technical challenges and achieving mass production of advanced products, and have made a significant contribution to the company's strategic layout in the high-end market.
Place of Birth: Ma’anshan Anhui Province
Date of Birth: July 1987
Mr. Xu Chao, the current R&D Manager of Electronic Circuit Foil Technology, has been honored as the "Courageous Pioneer" of 2024 and the "Innovation Pioneer” of 2025.
In June 2009, Xu Chao formally entered the electrolytic copper foil industry, and has devoted himself to his mission with a sincere heart and pursued his passion with dedication. Starting from grassroots positions across various production stages, he shed his impetuousness and delved deeply into his work. Through rigorous refinement on the production front line, he transformed his roles, from the details of each process to the key points of production, from the logic of the process to the practical skills, he meticulously studied and mastered everything. With a solid foundation in frontline work and a modest academic attitude, he earned unanimous recognition throughout the company.
In April 2025, Xu Chao was transferred to the R&D Department. He empowered innovation with his frontline experience and tackled challenges with craftsmanship, upgraded the performance of electronic circuit foil products and developed new products. With his persistent research spirit and collaborative responsibility, he helps the team break through core technological barriers, successfully propels the company to achieve its best historical performance.
The dedication continued to bear fruit. Under the joint efforts of Xu Chao and the R&D team, the company successfully achieved mass production capabilities for the RTF1/2/3 and HVLP1/2/3 series products in 2025. The HVLP series, with its core advantages of high peel strength and high elongation, achieved a leap in the basic physical properties of copper foil. It became a core product for the company to capture the high-end market, strongly promoting a crucial, milestone step in the company's development in the high-end electronic circuit copper foil field, and injecting strong innovative momentum into the company's high-quality development.
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