Low-Brittleness High-Temperature-Resistant Copper Foi

Low-Brittleness High-Temperature-Resistant Copper Foi

Low-Brittleness, High-Temperature-Resistant Copper Foil overcomes brittleness limitation of high-strength materials, delivering ≥600MPa strength, ≥4% elongation, exceptional toughness, and thermal stability via nanocrystalline structure—ideal for power batteries and high-end electronics. 

Physical Properties Data Sheet

Project

Unit

Parameters

Nominal thickness

μm

6

Surface density

g/m2

53.5 ± 1.5

Copper purity

%

≥99.8

Tensile Strength at Room Temperature

MPa

≥600

Room Temperature Elongation

%

≥4

Tensile strength after folding

MPa

≥450

Tensile strength after baking at 200℃ for 3 hours

Mpa

≥550MPa

Antioxidant activity

/

140℃/15min – No oxidation

SEM Morphology

Shiny side × 2000
Low-Brittleness High-Temperature-Resistant Copper Foi
Matte side ×2000
Low-Brittleness High-Temperature-Resistant Copper Foi

Application Scenarios

New Energy Vehicle
Low-Brittleness High-Temperature-Resistant Copper Foi
AI Server
Low-Brittleness High-Temperature-Resistant Copper Foi
Flexible Electronics
Low-Brittleness High-Temperature-Resistant Copper Foi

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