3–10 μm:

Ultra-thin specification reduces the ratio of non-active materials within cells, significantly increasing energy density and extended range boundaries for new energy vehicles and low-altitude aircraft.

300–600 MPa:

Copper foil with tensile strengths from 300 to 600 MPa provides critical mechanical support for power batteries. It accommodates high-energy-density designs and fast charging, ensuring electrode structural stability while enhancing cycle life, safety, and reliability.

≥5%:

With elongation ≥5%, it effectively help electrodes absorb stress from volume expansion during charge-discharge cycles, reducing electrode microcracks and ensuring structural integrity and durability in demanding applications.

3–6 μm:

With a 3-6μm ultra-thin copper foil, 3C batteries achieves higher energy density, enabling slimmer designs for smartphones, laptops, and wearables while significantly extending battery life.

500–800 MPa:

With a tensile strength range of 500-800 MPa, it provides robust support for high-energy-density anode, effectively suppressing electrodes expansion, thus ensuring structural stability and long-term cycling performance in slim 3C battery designs.

≥6%:

An elongation above 6% effectively absorbs volume expansion stress in silicon-carbon anodes during cycling, while adapting to frequent bending in wearable devices, ensuring structural integrity and cycling durability.

6–10 μm:

With a thickness specification of 6-10μm, it provides more robust structural support for energy storage batteries, enhancing the electrode's tolerance to long-term, high-cycles charge/discharge operations.

≥300 MPa:

A tensile strength above 300 MPa provides critical mechanical support for energy storage batteries, effectively preventing electrode deformation during long-term, charge/discharge cycles and enabling stable operation in photovoltaic and wind energy storage applications.

≥20 years:

With excellent chemical stability and creep resistance, Our copper foil provides a durable and reliable current collector foundation for energy storage cells, ensuring capacity retention and safe, stable operation over 20 years.

Corrosion Resistance:

With reinforced corrosion resistance, the multi-metal current collector effectively suppresses chemical side reactions and delamination risks at highly active interfaces. It establishes stable and efficient internal current pathways for solid-state batteries

≥1500 MPa:

With an extreme ultra-high tensile strength above 1500 MPa, it provides exceptional mechanical support while withstanding electrode interfacial stress. This compatibility with new solid-state battery manufacturing processes helps overcome safety and lifespan limitations, thus accelerating industrial adoption.

Customized Porosity:

By precisely controlling the porous structure, copper usage is significantly reduced while maintaining conductivity, enabling weight reduction and enhanced energy density for solid-state batteries.

10–105 μm:

Custom thickness enables versatile substrates for high-density and high-power applications, meeting heat dissipation and reliability needs in compact spaces.

99.8%:

Featuring 99.8% purity, this copper foil minimizes signal loss and thermal risks, providing a reliable conductive base for automotive electronics and high-end PCBs to ensure durable circuit performance.

High Peel Strength:

Ensuring secure copper-substrate bonding, withstanding harsh conditions to provide reliable, delamination-free connections for demanding applications like automotive electronics and mobile PCBs.

≤1.5 μm:

With a hyper ultra-low profile below 1.5μm, it provides an exceptionally smooth surface for AI server PCBs , significantly reducing high-frequency signal transmission loss and latency. This ensures seamless, lossless data transfer between chips, supporting continuous advancement in computing power.

200℃:

With high thermal stability, it withstands extreme thermal loads from AI chips and servers, maintaining structural integrity and conductivity under prolonged high temperatures 200℃. This provides a reliable thermal and electrical foundation for sustained high-intensity computing power.

Stable Physical Properties:

Its exceptional stability preserves dimensional and electrical properties under AI servers' high-density, high-heat conditions, ensuring signal integrity, reliability, and 24/7 operational support for computing infrastructure.

≤1.0 μm:

Ultra-smooth copper foil minimizes signal loss and distortion in millimeter-wave bands, ensuring signal purity and system stability for 5G/6G base stations, radar, and antennas.

Stable Peeling Strength:

Secure copper-substrate bonding under extreme temperatures and vibration ensures stable 5G/6G signal transmission with zero interruption for outdoor base stations and radar antennas.

Thickness Uniformity:

Uniform copper foil thickness ensures consistent high-frequency PCB impedance, enabling precise millimeter-wave transmission with low reflection and distortion for 5G/6G base stations and antennas.

≤3 μm:

Designed with ≤3μm thickness for MSAP processes, this foil provides a precision starting layer for micron-scale circuits, boosting wiring density and signal integrity in IC substrates to support advanced chip packaging.

≤2 μm:

With ≤2μm roughness, this smooth surface minimizes skin effect and signal loss, ensuring signal integrity for IC substrates and advanced chip packaging with lossless high frequency/ high-speed data transfer.

Peelability:

Ensuring clean, complete carrier removal after ultra-thin copper foil processing, it enables damage-free fine-line circuitry—key to IC substrate yield improvement and advanced packaging.

Electronic System:

Ultra-smooth, low-profile copper foil enables near-lossless signal transmission and real-time AI chip data flow, giving humanoid robots sharp “nerves” for precise, seamless interaction.

Power System:

High strength, elongation, and lightweight thinness support battery cells in compact robots, resisting joint motion stress, boosting energy density, and ensuring long-term power safety and stability.

Electronic System:

With exceptional thermal stability and fatigue resistance, it ensures precise signals and stable power for flight control and communication systems under harsh conditions, building long-lasting, all-weather reliable circuitry.

Power System:

Exceptional thermal stability and strength withstand temperature shocks and high-frequency landing and takeoff impact, ensuring durable, reliable power output for high-energy-density battery systems.